Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It only happens when the kinetic energy of the incoming particles is much higher than conventional thermal energies. This process can lead, during prolonged ion or plasma bombardment of a material, to significant erosion of materials, and can thus be harmful. On the other hand, it is commonly utilized for thin-film deposition, etching and analytical techniques.
SSP1000 cubic sputtering system is a desktop compact system enabling high deposition performance at low cost.
Its unique design allows change of deposition direction (upward, sideward and downward), so experiments in all three directions can be performed within one simple device.
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